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Submission + - DARPA wants electronics with radically novel liquid cooling technology (networkworld.com)

coondoggie writes: "With increased electronic minituriztion and the density of the chips running such devices heat is a mortal enemy for the power and scalability of such systems. DARPA today announced a program called Intrachip/Interchip Enhanced Cooling (ICECool) that it hopes will go the heart of such heat problems by building chips with a drastically different way of cooling that uses what the agency calls a microfluid channel inside the chip or component that will more effectively dissipate heat than current cooling technologies."
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DARPA wants electronics with radically novel liquid cooling technology

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I've never been canoeing before, but I imagine there must be just a few simple heuristics you have to remember... Yes, don't fall out, and don't hit rocks.

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