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coondoggie writes "With increased electronic minituriztion and the density of the chips running such devices heat is a mortal enemy for the power and scalability of such systems. DARPA today announced a program called Intrachip/Interchip Enhanced Cooling (ICECool) that it hopes will go the heart of such heat problems by building chips with a drastically different way of cooling that uses what the agency calls a microfluid channel inside the chip or component that will more effectively dissipate heat than current cooling technologies." Link to Original Source
He: Let's end it all, bequeathin' our brains to science.
She: What?!? Science got enough trouble with their OWN brains.
-- Walt Kelly