coondoggie writes: "With increased electronic minituriztion and the density of the chips running such devices heat is a mortal enemy for the power and scalability of such systems. DARPA today announced a program called Intrachip/Interchip Enhanced Cooling (ICECool) that it hopes will go the heart of such heat problems by building chips with a drastically different way of cooling that uses what the agency calls a microfluid channel inside the chip or component that will more effectively dissipate heat than current cooling technologies." Link to Original Source
Real programmers don't bring brown-bag lunches. If the vending machine
doesn't sell it, they don't eat it. Vending machines don't sell quiche.